Here’s What You Need To Know About Laser Marking
It is important to mark silicon wafers with a laser before manufacturing. In a laser machine, a concentrated light beam is used to create permanent marks on semiconductor packages. A laser isn’t a normal word; it is the acronym for “Light Amplification by Stimulated Emission of Radiation”, a technique that focuses and directs light particles. Using a laser marking machine that can be programmed to precisely meet specifications, wafers are laser marked throughout the manufacturing process, allowing them to be tracked. Using this лазерная маркировка, machines should be able to detect the wafers’ locations. Since the mark cannot interfere with any underlying processes and the wafer cannot be damaged, the marking must also be very finely detailed. Precision lasers must be used.
Where Do Silicon Wafers Come From?
What are the laser marks on silicon wafers used for identification? Wafers are semiconductors that are used in every type of electronic device. In the form of a round disk with a mirrored surface, silicon wafers look similar to disks. When laser marking silicon wafers, extreme care must be taken because they are impurity-free.
An Overview of Laser Marking
Computer interaction is required for marking silicon wafers. This stage of the process involves examining a map of the wafer on a marking document. The wafer’s parameters, functions, and other attributes are detailed in that section.
You can observe how your data will be translated into a silicon wafer from the other side of the screen. The wafer can be placed into the laser marking machine after the settings are correct. A mechanical hand is used to bring the wafer to the marking station. No human interaction will be necessary, as the entire process will be automated. After the machine locates the target location, it will shine a laser beam on the surface of the water. Upon completion of that process, the completed project is placed in the receiving box, from which it can be removed.
Laser Marking Offers Several Advantages
Correctness
The precision of laser marking makes it a highly effective method of manufacturing wafers. The superior technology used by the company ensures that even the smallest details are accurately captured. Computers can read a few millimeter-thick markings on silicon wafers, so tracking can be made easy.
Fast
In addition to being highly precise, laser marking is also extremely fast. A stack of silicon wafers can be laser marked in minutes, from placement to marking to completion. Despite being slower than other marking methods, laser annealing leaves no marks on the surface.
The Top Layer Only
Silicon is not actually removed from the surface by laser marking. Laser marking only changes the color below the silicon surface. The silicon itself does not suffer any damage.
There Is A Permanent Effect
Wafers made of silicon are permanently etched with markings. In most cases, heat leaves a mark just beneath the surface, preventing it from fading away.
The Full Automation Of A Process
The whole process is automated. No interaction is required on the part of the user. Mechanical arms can pick up silicon wafers and transport them within the machine so they can be marked by mechanical arms. As a result, laser marking machines are fully safe to use since the lasers won’t interact with the wafer once the surface color has been changed. Additionally, costly mistakes will be less likely. When human errors are eliminated, costly mistakes are less likely.
Safe For The Environment
Laser marking is an environmentally friendly method of marking because it does not use chemicals or inks. Lasers are also very efficient, so they are ideal for marking silicon wafers since they consume very little energy.